Particle Arrangement Design for Predicting the Percolation Threshold of Silver/Epoxy Composite for Electrically Conductive Adhesive Application

Dublin Core

Title

Particle Arrangement Design for Predicting the Percolation Threshold of Silver/Epoxy Composite for Electrically Conductive Adhesive Application

Creator

Zulkarnain, M
Husaini, M
Mariatti, M
Azid, I.A.

Publisher

Scopus

Date

2015

Language

en

Identifier

http://uilis.unsyiah.ac.id/~unsyiana/index.php?p=show_detail&id=5